Introduction
Wafer Stacking and 3D Memory Test
Built-in Self-Test for TSVs
Pre-Bond TSV Test Through TSV Probing
Pre-Bond TSV Test Through TSV Probing
Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths
Post-Bond Test Wrappers and Emerging Test Standards
Test-Architecture Optimization and Test Scheduling
Conclusions.