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The effect of thermal shock on clay bodies; a report of an investigation conducted by the Engineering Experiment Station, University of Illinois in cooperation with the Clay Products Association
Author
Title
The effect of thermal shock on clay bodies; a report of an investigation conducted by the Engineering Experiment Station, University of Illinois in cooperation with the Clay Products Association. By William R. Morgan.
Published
Urbana, University of Illinois [1931]
Physical Description
30 p. diagrs. 23 cm.
Variant and related titles
Thermal shock on clay bodies, The effect of.
Format
Books
Language
English
Added to Catalog
June 01, 2002
Series
Bulletin, Engineering Experiment Station, University of Illinois, no. 229
Subjects
Also listed under
Clay Products Association of America (New York, N.Y.)
Bookmark As
Citation
