0471574813

9780471574811

"Sponsored by the Electrochemical Society, Inc., Pennington, New Jersey."

Includes index.

Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.

For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

The Electrochemical Society series

1. Introduction

2. Basics of Interactions Between Flat Surfaces

3. Influence of Particles, Surface Steps, and Cavities

4. Surface Preparation and Room-Temperature Wafer Bonding

5. Thermal Treatment of Bonded Wafer Pairs

6. Thinning Procedures

7. Electrical Properties of Bonding Interfaces

8. Stresses in Bonded Wafers

9. Bonding of Dissimilar Materials

10. Bonding of Structured Wafers

11. Mainstream Applications

12. Emerging and Future Applications.

Semiconductors > Bonding.

Semiconductors > Bonding.

Semiconducteurs > Connexions électriques > Soudage.

Electrochemical Society.