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Society of Photo-Optical Instrumentation Engineers
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Microelectronic packaging

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1.
MEMS design, fabrication, characterization, and packaging 30 May-1 June 2001, Edinburgh, UK
Published
Bellingham, Wash., USA : SPIE, ©2001.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
2.
Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore
Published
Bellingham, Wash., USA : SPIE, ©2000.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
3.
Optoelectronic interconnects II 26-27 January 1994, Los Angeles, California
Published
Bellingham, Wash., USA : SPIE, ©1994.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online