Books+ Search Results
Author
International Symposium on High Density Packaging and Microsystem Integration
Published
Piscataway, NJ : Institute of Electrical and Electronic Engineers
Online
Location
Yale Internet Resource >> None
Format
Journals & Newspapers / Online
Published
Bellingham, Wash., USA : SPIE, ©2001.
Online
Location
Yale Internet Resource >> None
Format
Books / Online
Published
Bellingham, Wash., USA : SPIE, ©2000.
Online
Location
Yale Internet Resource >> None
Format
Books / Online
Author
Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, issuing body
Published
[Bellingham, Wash.] : [SPIE--the International Society for Optical Engineering]
Piscataway, NJ : Institute of Electrical and Electronics Engineers
Online
Location
Yale Internet Resource >> None
Format
Journals & Newspapers / Online
Published
Washington, DC : American Chemical Society, 1995.
Online
Location
Yale Internet Resource >> None
Format
Books / Online
Published
Bellingham, Wash., USA : SPIE, ©1994.
Online
Location
Yale Internet Resource >> None
Format
Books / Online
Author
IEEE Multi-Chip Module Conference
Published
[Los Alamitos, Calif.] : [IEEE Computer Society Press]
Online
Location
Yale Internet Resource >> None
Format
Journals & Newspapers / Online