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Society of Photo-optical Instrumentation Engineers
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Microelectronic packaging

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1.
Photonics packaging, integration, and interconnects VII : 23-25 January, 2007, San Jose, California, USA
Published
Bellingham, Wash. : SPIE, ©2007.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
2.
Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA
Published
Bellingham, Wash. : SPIE, ©2007.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
3.
Reliability, packaging, testing, and characterization of MEMS/MOEMS V : 25-26 January 2006, San Jose, California, USA
Published
Bellingham, Wash. : SPIE, ©2006.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
4.
MEMS/MOEMS : advances in photonic communications, sensing, metrology, packaging and assembly : 28-29 October 2002, Brugge, Belgium
Published
Bellingham, Wash., USA : SPIE, ©2003.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
5.
Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia
Published
Bellingham, Wash. : SPIE, ©2001.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
6.
Functional integration of opto-electro-mechanical devices and systems : 24-25 January 2001, San Jose, USA
Published
Bellingham, Wash., USA : SPIE, ©2001.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
7.
2000 HD International Conference on High-Density Interconnect and Systems Packaging : 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA
Author
HD International Conference on High-Density Interconnect and Systems Packaging (2000 : Denver, Colo.)
Published
Reston, VA : IMAPS ; [Bellingham, Wash.] : Published in cooperation with SPIE--the International Society for Optical Engineering, ©2000.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
8.
Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia
Published
Bellingham, Wash. : SPIE, ©1999.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
9.
Optoelectronic integrated circuits and packaging III : 28-29 January, 1999, San Jose, California
Published
Bellingham, Wash. : SPIE, ©1999.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
10.
Optoelectronic interconnects V : 28-29 January, 1998, San Jose, California
Published
Bellingham, Wash. : SPIE, ©1998.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
11.
Microelectronic packaging and laser processing : 25-26 June 1997, Singapore
Published
Bellingham, Wash. : SPIE, ©1997.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
12.
Optoelectronic interconnects and packaging IV : 12-14 February, 1997, San Jose, California
Published
Bellingham, Wash. : SPIE, ©1997.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
13.
Optoelectronic packaging : 1-2 February 1996, San Jose, California
Published
Bellingham, Wash. : SPIE, ©1996.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
14.
Microelectronic interconnects and packaging, optical and electrical technologies
Published
Bellingham, Wash., USA : SPIE, ©1991.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online