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Proceedings
Uniform Title
Proceedings (Online)
Title
Proceedings [electronic resource] / International Conference on Wafer Scale Integration.
ISSN
1063-2204
Published
Washington, D.C. : IEEE Computer Society Press, ©1989-©1995.
Frequency
Annual
Extent
Jan. 3-5, 1989-7th (1995).
Numbering Peculiarities
Issues for 1989-1995 also called 1st-7th.
Local Notes
Access is available to the Yale community.
Notes
Published: Los Alamitos, Calif., 1992; New York, N.Y., 1993-1995.
Conferences for 1989-1993 sponsored by the IEEE Computer Society and the IEEE Components, Hybrids, and Manufacturing Technology Society; 1994-1995 with the IEEE Components, Packaging, and Manufacturing Technology Society.
Access and use
Access restricted by licensing agreement.
Variant and related titles
Proc. - Int. Conf. Wafer Scale Integr.
Proceedings - International Conference on Wafer Scale Integration
Format
Journals & Newspapers / Online
Language
English
Added to Catalog
May 17, 2024
Subjects
Also listed under
IEEE Computer Society.
IEEE Components, Hybrids, and Manufacturing Technology Society.
Components, Packaging & Manufacturing Technology Society.
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