9780819470591

0819470597

Title from PDF title page (viewed on Apr. 2, 2008).

Issued as part of the SPIE Digital Library.

Proceedings of SPIE, v. 6884

MEMS reliability: coming of age / Michael R. Douglass

Understanding and improving longevity in RF MEMS capacitive switches / Chuck Goldsmith [and others]

Experimental study of electrical breakdown in MEMS devices with micrometer scale gaps / P. Carazzetti, Ph. Renaud, and H.R. Shea

Degradation evaluation of microelectromechanical thermal actuators / J.K. Luo [and others]

Development of nondestructive testing/evaluation methodology for MEMS / James L. Zunino III [and others]

Measurement of thin films and interfacial surface roughness using SWLI / Mike Conroy

Reliability of MEMS devices in shock and vibration overload situations / Steffen Kurth [and others]

Mechanics of the dynamic release process for stiction failed microcantilever beams using structural vibrations / Amit Savkar and Kevin D. Murphy

A perspective on the reliability of MEMS-based components for telecommunications / John C. McNulty

Reliability testing and analysis of safing and arming devices for army fuzes / James L. Zunino III, Donald R. Skelton, and Charles Robinson

Interferometric characterization of MOEMS devices in cryogenic environment for astronomical instrumentation / Frederic Zamkotsian [and others]

Qualification testing of engineering camera and platinum resistance thermometer (PRT) sensors for Mars Science Laboratory (MSL) project under extreme temperatures to assess reliability and to enhance mission assurance / Rajeshuni Ramesham, Justin N. Maki, and Gordon C. Cucullu

Measuring MEMS through silicon caps / Matthew Hazel and Maurice Karpman

Characterization of microresistance welding with electrothermal actuator for microassembly / Chun-Wei Chang and Wensyang Hsu

Study of Ag-In solder as low temperature wafer bonding intermediate layer / Riko I Made [and others]

Microfabricated implantable pressure sensor for flow measurement / Sheng Liu [and others]

Photosensitive etch protection coating for silicon wet-etch applications / J. Dalvi-Malhotra, X.F. Zhong, and C. Planje

MEMS as low-cost high-volume semiconductor solutions: it's all in the packaging and assembly / Joe Brown [and others]

Measuring mass flows in hermetically sealed MEMS and MOEMS to ensure device reliability / R.C. Kullberg and D.J. Rossiter

A new model for vacuum quality and lifetime prediction in hermetic vacuum bonded MEMS / A. Bonucci [and others]

Challenges of designing and processing extreme low-G microelectromechanical system (MEMS) accelerometers / Thomas P. Swiler [and others]

Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs / S. Garcia-Blanco [and others]

Electrical measurement of undercut in surface micromachining / Somashekara Bhat and Enakshi Bhattacharya

Support for microsystems simulation: Are we watching the clock? / C.K. Drummond and F.J. Lisy

Confocal microscopy scanned by digital micromirror device with stray light filters / Chuan-Cheng Hung [and others]

Uncertainty analysis on optical testing with a Shack-Hartmann sensor and a point source / Dong Won Kang [and others].

Microelectromechanical systems > Reliability > Congresses.

Microelectromechanical systems > Testing > Congresses.

Microelectronic packaging > Congresses.