McGraw-Hill's AccessEngineering.
Development and fabrication of IC chips.
Plastics, elastomers, and composites.
Ceramics and glasses.
Metals.
Solder technologies for electronic packaging and assembly.
Electroplating and deposited metallic coatings.
Printed circuit board fabrication.
Materials and processes for hybrid microelectronics and multichip modules.
Adhesives, underfills, and coatings in electonics assemblies.
Thermal management materials and systems.