Print version c2008.

Description based on cover image and table of contents, viewed on June 3, 2011.

Printed circuits handbook

McGraw-Hill's AccessEngineering.

Legislation and impact on printed circuits / Gary M. Freedman

Electronic packaging and high-density interconnectivity / Clyde F. Coombs Jr.

Semiconductor packaging technology / John W. Stafford

Advanced component packaging / Tarak A. Railkar

Types of printed wiring boards / Dr. Hayao Nakahara

Introduction to base materials / Edward J. Kelley

Base material components / Edward J. Kelley

Properties of base materials / Edward J. Kelley

Base materials performance issues / Edward J. Kelley

Impact of lead-free assembly on base materials / Edward J. Kelley

Selecting base materials for lead-free assembly applications / Edward J. Kelley

Laminate qualification and testing / Michael Roesch

Physical characteristics of the PCB / Lee W. Ritchey

PCB design process / Lee W. Ritchey

Electrical and mechanical design parameters / Ralph J. Hersey, Jr.

Current carrying capacity in printed circuits / Mike Jouppi

PCB design for thermal performance / Darvin Edwards

Information formating and exchange / Bini Elhanan

Planning for design, fabrication, and assembly / Happy T. Holden

Manufacturing information, documentation, and transfer including cam tooling for fab and assembly / Happy T. Holden

Embedded components / Dennis Fritz

Introduction to high-density interconnection (HDI) technology / Happy T. Holden

Advanced high-density interconnection (HDI) technologies / Happy T. Holden

Drilling processes / Hans Vandervelde

Precision interconnect drilling / Terry Haney

Imaging / Brian F. Conaghan

Multilayer materials and processing / C. D. (Don) Dupriest

Preparing boards for plating / Jim Watkowski

Electroplating / Jim Watkowski

Direct plating / Dr. Hayao Nakahara

PWB manufacture using fully electroless copper / Dr. Hayao Nakahara

Printed circuit board surface finishes / Don Cullen

Solder mask / David A. Vaughan

Etching process and technologies / Marshall I. Gurian

Machining and routing / Gary Roper

Bare board test objectives and definitions / David J. Wilkie

Bare board test methods / David J. Wilkie

Bare board test equipment / David J. Wilkie

HDI bare board special testing methods / David J. Wilkie

Assembly processes / Paul T. Vianco

Conformal coating / Jody Byram

Solderability: incoming inspection and wetting balance technique / Gerard O?Brien

Fluxes and cleaning / Gregory C. Munie

Soldering fundamentals / Gary M. Freedman

Soldering materials and metallurgy / Gary M. Freedman

Solder fluxes / Gary M. Freedman

Soldering techniques / Gary M. Freedman

Soldering repair and rework / Gary M. Freedman

Press-fit interconnection / Gary M. Freedman

Land grid array interconnect / Gary M. Freedman

Acceptability and quality of fabricated boards / Robert (Bob) Neves

Acceptability of printed circuit board assemblies / Mel Parrish

Assembly inspection / Stacy Kalisz Johnson

Design for testing / Kenneth P. Parker

Loaded board testing / Kenneth P. Parker

Conductive anodic filament formation / Dr. Laura J. Turbini

Reliability of printed circuit assemblies / Judith Glazer

Component-to-PWB reliability-the impact of design variables and lead free / Mudasir Ahmad

Component-to-PWB reliability: estimating solder joint reliability and the impact of lead-free solders / Mudasir Ahmad

Process waste minimization and treatment / Joyce M. Avery

Flexible circuit applications and materials / Dominique K. Numakura

Design of flexible circuits / Dominique K. Numakura

Manufacturing of flexible circuits / Dominique K. Numakura

Termination of flexible circuits / Dominique K. Numakura

Multilayer flex and rigid/flex / Dominique K. Numakura

Special constructions of flexible circuits / Dominique K. Numakura

Quality assurance of flexible circuits / Dominique K. Numakura.

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