Legislation and impact on printed circuits / Gary M. Freedman
Electronic packaging and high-density interconnectivity / Clyde F. Coombs Jr.
Semiconductor packaging technology / John W. Stafford
Advanced component packaging / Tarak A. Railkar
Types of printed wiring boards / Dr. Hayao Nakahara
Introduction to base materials / Edward J. Kelley
Base material components / Edward J. Kelley
Properties of base materials / Edward J. Kelley
Base materials performance issues / Edward J. Kelley
Impact of lead-free assembly on base materials / Edward J. Kelley
Selecting base materials for lead-free assembly applications / Edward J. Kelley
Laminate qualification and testing / Michael Roesch
Physical characteristics of the PCB / Lee W. Ritchey
PCB design process / Lee W. Ritchey
Electrical and mechanical design parameters / Ralph J. Hersey, Jr.
Current carrying capacity in printed circuits / Mike Jouppi
PCB design for thermal performance / Darvin Edwards
Information formating and exchange / Bini Elhanan
Planning for design, fabrication, and assembly / Happy T. Holden
Manufacturing information, documentation, and transfer including cam tooling for fab and assembly / Happy T. Holden
Embedded components / Dennis Fritz
Introduction to high-density interconnection (HDI) technology / Happy T. Holden
Advanced high-density interconnection (HDI) technologies / Happy T. Holden
Drilling processes / Hans Vandervelde
Precision interconnect drilling / Terry Haney
Imaging / Brian F. Conaghan
Multilayer materials and processing / C. D. (Don) Dupriest
Preparing boards for plating / Jim Watkowski
Electroplating / Jim Watkowski
Direct plating / Dr. Hayao Nakahara
PWB manufacture using fully electroless copper / Dr. Hayao Nakahara
Printed circuit board surface finishes / Don Cullen
Solder mask / David A. Vaughan
Etching process and technologies / Marshall I. Gurian
Machining and routing / Gary Roper
Bare board test objectives and definitions / David J. Wilkie
Bare board test methods / David J. Wilkie
Bare board test equipment / David J. Wilkie
HDI bare board special testing methods / David J. Wilkie
Assembly processes / Paul T. Vianco
Conformal coating / Jody Byram
Solderability: incoming inspection and wetting balance technique / Gerard O?Brien
Fluxes and cleaning / Gregory C. Munie
Soldering fundamentals / Gary M. Freedman
Soldering materials and metallurgy / Gary M. Freedman
Solder fluxes / Gary M. Freedman
Soldering techniques / Gary M. Freedman
Soldering repair and rework / Gary M. Freedman
Press-fit interconnection / Gary M. Freedman
Land grid array interconnect / Gary M. Freedman
Acceptability and quality of fabricated boards / Robert (Bob) Neves
Acceptability of printed circuit board assemblies / Mel Parrish
Assembly inspection / Stacy Kalisz Johnson
Design for testing / Kenneth P. Parker
Loaded board testing / Kenneth P. Parker
Conductive anodic filament formation / Dr. Laura J. Turbini
Reliability of printed circuit assemblies / Judith Glazer
Component-to-PWB reliability-the impact of design variables and lead free / Mudasir Ahmad
Component-to-PWB reliability: estimating solder joint reliability and the impact of lead-free solders / Mudasir Ahmad
Process waste minimization and treatment / Joyce M. Avery
Flexible circuit applications and materials / Dominique K. Numakura
Design of flexible circuits / Dominique K. Numakura
Manufacturing of flexible circuits / Dominique K. Numakura
Termination of flexible circuits / Dominique K. Numakura
Multilayer flex and rigid/flex / Dominique K. Numakura
Special constructions of flexible circuits / Dominique K. Numakura
Quality assurance of flexible circuits / Dominique K. Numakura.