Books+ Search Results
Printed Circuits Handbook, Seventh Edition
Author
Title
Printed Circuits Handbook, Seventh Edition / Clyde Coombs, Happy Holden.
ISBN
9780071833967
007183396X
9780071833950 (print)
Edition
7th edition.
Publication
New York, N.Y. : McGraw-Hill Education, [2016].
Copyright Notice Date
?2016.
Physical Description
1 online resource (1504 pages) : 500 illustrations.
Local Notes
Access is available to the Yale community.
Notes
Electronic reproduction. New York, N.Y. : McGraw Hill, 2016. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
In English.
Description based on e-Publication PDF.
Access and use
Access restricted by licensing agreement.
Variant and related titles
McGraw-Hill's AccessEngineering.
Other formats
Also available in print edition.
Print version: Printed Circuits Handbook, Seventh Edition, New York, N.Y. : McGraw Hill, [2016],
Format
Books / Online
Language
English
Added to Catalog
August 30, 2019
Bibliography
Includes bibliographical references and index.
Contents
Cover
Title Page
Copyright Page
Contents
Contributors
Preface
Part 1 Printed Circuit Technology Drivers
Chapter 1. Electronic Packaging and High-Density Interconnectivity
Chapter 2. Types of Printed Wiring Boards
Part 2 Managing the Printed Circuit Supply Chain
Chapter 3. Basics of Printed Circuit Supply Chain Management
Chapter 4. Design for Manufacturability
Chapter 5. Manufacturing Information, Documentation, Formatting, and Exchange
Chapter 6. Supplier Selection and Qualification
Chapter 7. Process Control, Monitoring, and Incoming Inspection
Chapter 8. Product Acceptance and Feedback
Part 3 Materials
Chapter 9. Introduction to Base Materials
Chapter 10. Base Material Components
Chapter 11. Properties of Base Materials
Chapter 12. Base Material Performance in PCBs
Chapter 13. The Impact of Lead-Free Assembly on Base Materials
Chapter 14. Selecting Base Materials
Chapter 15. Laminate Qualification and Testing
Part 4 Engineering and Design
Chapter 16. Planning for Design, Fabrication, and Assembly
Chapter 17. Physical Characteristics of the PCB
Chapter 18. Electronic Design Automation and Printed Circuit Design Tools
Chapter 19. The PCB Design Process
Chapter 20. Electrical and Mechanical Design Parameters
Chapter 21. The Basics of Printed Circuit Board Design
Chapter 22. Current Carrying Capacity in Printed Circuits
Chapter 23. PCB Design for Thermal Performance
Chapter 24. Embedded Components
Part 5 High- Density Interconnection
Chapter 25. Introduction to High-Density Interconnection Technology
Chapter 26. Advanced High-Density Interconnection Technologies
Part 6 Fabrication
Chapter 27. CAM Tooling for Fab and Assembly
Chapter 28. Drilling Processes
Chapter 29. Precision Interconnect and Laser Drilling
Chapter 30. Imaging and Automated Optical Inspection
Chapter 31. Multilayer Materials and Processing
Chapter 32. Preparing Boards for Plating
Chapter 33. Electroplating
Chapter 34. Direct Plating
Chapter 35. Printed Circuit Board Surface Finishes
Chapter 36. Solder Mask
Chapter 37. Etching Process and Technologies
Chapter 38. Routing and V-Scoring
Part 7 Bare Board Test
Chapter 39. Bare Board Test Objectives and Definitions
Chapter 40. Bare Board Test Methods
Chapter 41. Bare Board Test Equipment
Chapter 42. HDI Bare Board Special Testing Methods
Part 8 Assembly, Soldering Materials, and Processes
Chapter 43. Assembly Processes
Chapter 44. Conformal Coating
Chapter 45. Fluxes and Cleaning
Chapter 46. Soldering Fundamentals
Chapter 47. Soldering Materials and Metallurgy
Chapter 48. Solder Fluxes
Chapter 49. Soldering Techniques
Chapter 50. Soldering Repair and Rework
Part 9 Nonsolder Interconnection
Chapter 51. Press-Fit Interconnection
Chapter 52. Pressure-Interconnect Land Grid Array Systems
Part 10 Quality
Chapter 53. Acceptability and Quality of Fabricated Boards
Chapter 54. Acceptability of Printed Circuit Board Assemblies
Chapter 55. Asssembly Inspection
Chapter 56. Design for Testing
Chapter 57. Loaded Board Testing
Chapter 58. Failure Modes and Effects Analysis
Part 11 Reliability
Chapter 59. Conductive Anodic Filament Formation
Chapter 60. Reliability of Printed Circuit Boards
Chapter 61. Reliability of Microvia Printed Circuit Boards
Chapter 62. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
Chapter 63. Lead-Free Solder Joint Reliability: Fundamentals and Design-for-Reliability Rules
Chapter 64. Component-to-PWB Reliability: Estimating Solder Joint Reliability and the Impact of Lead-Free Solders
Part 12 Flexible Circuits
Chapter 65. Flexible Circuit Applications and Materials
Chapter 66. Design of Flexible Circuits
Chapter 67. Manufacturing Flexible Circuits
Chapter 68. Termination Options for Flexible Circuits
Chapter 69. Multilayer Flex and Rigid Flex
Chapter 70. Special Constructions of Flexible Circuits
Chapter 71. Flexible Circuit Quality Assurance: Principles and Practices
Appendix. Summary of Key Component, Material, Process, and Design Standards
Glossary
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
Index
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
V
W.
Genre/Form
Electronic books.
Also listed under
Bookmark As
Citation
