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120719s2012 waua fob 000 0 eng d
035
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(OCoLC)ocn801513077
040
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SPIES
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eng
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rda
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pn
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SPIES
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OCLCQ
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OCLCO
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OCLCQ
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OCLCA
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OCLCQ
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KNOVL
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OCLCF
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DEBSZ
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ZCU
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OCLCQ
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OCLCO
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N$T
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KNOVL
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YDXCP
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OCLCQ
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STF
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OCLCQ
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FTU
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MERER
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OCLCQ
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BUF
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RRP
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OCLCA
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AU@
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OCLCQ
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ORZ
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EYM
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OCLCO
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OCLCQ
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E7B
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COO
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VT2
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KIJ
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CEF
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U3W
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WYU
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LVT
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UWW
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BWN
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SFB
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EBLCP
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MERUC
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HS0
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OCLCQ
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VI#
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OCLCO
019
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830029110
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854970277
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868957930
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913039600
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961846162
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988616441
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999583668
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1065922697
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1086974359
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1124350583
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1127178228
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1136410292
020
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9780819490933
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(electronic bk.)
020
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0819490938
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(electronic bk.)
020
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9781628701043
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(electronic bk.)
020
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1628701048
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(electronic bk.)
020
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9780819490926
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(print)
020
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081949092X
024
7
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10.1117/3.924283
|2
doi
050
4
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TK7871.85
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.X53 2012
100
1
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Xiao, Hong,
|d
1961-
|0
http://id.loc.gov/authorities/names/nb99175255
245
1
0
|a
Introduction to semiconductor manufacturing technology /
|c
Hong Xiao.
250
|a
Second edition.
264
1
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Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) :
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SPIE Press,
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[2012]
264
4
|c
©2012
300
|a
1 online resource (xix, 656 pages) :
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illustrations
336
|a
text
|b
txt
|2
rdacontent
337
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computer
|b
c
|2
rdamedia
338
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online resource
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cr
|2
rdacarrier
340
|g
monochrome
|2
rdacc
340
|p
illustration
|2
rdaill
347
|a
text file
|2
rdaft
490
1
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SPIE Press monograph ;
|v
PM220
500
|a
"SPIE Digital Library."--Website
504
|a
Includes bibliographical references.
505
0
|a
Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary.
506
|a
Access restricted by licensing agreement.
520
|a
Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technologies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations.
588
0
|a
Online resource; title from digital title page (viewed on March 26, 2020).
546
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English.
590
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Access is available to the Yale community.
650
0
|a
Semiconductors
|x
Design and construction.
650
0
|a
Semiconductor industry.
|0
http://id.loc.gov/authorities/subjects/sh85119894
650
7
|a
Integrated circuits
|x
Design and construction
|2
fast
650
7
|a
Semiconductor industry
|2
fast
650
7
|a
Semiconductors
|x
Design and construction
|2
fast
710
2
|a
Society of Photo-Optical Instrumentation Engineers.
730
0
|a
Knovel.
|g
OCLC KB.
776
0
8
|i
Print version:
|z
081949092X
|z
9780819490926
|w
(DLC) 2012013231
830
0
|a
SPIE monograph ;
|v
PM220.
852
8
0
|b
yulint
|h
None
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Online resource
852
8
0
|z
Online resource
856
4
0
|y
Online book
|u
https://yale.idm.oclc.org/login?URL=https://app.knovel.com/hotlink/toc/id:kpISTE0002/introduction-to-semiconductor?kpromoter=marc
901
|a
TK7871.85
902
|a
Yale Internet Resource
|b
Yale Internet Resource >> None|DELIM|16682838
905
|a
online resource
907
|a
2023-10-02T16:18:43.000Z
946
|a
DO NOT EDIT. DO NOT EXPORT.
953
|a
https://app.knovel.com/hotlink/toc/id:kpISTE0002/introduction-to-semiconductor?kpromoter=marc