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Introduction to semiconductor manufacturing technology
Author
Title
Introduction to semiconductor manufacturing technology / Hong Xiao.
ISBN
9780819490933
0819490938
9781628701043
1628701048
9780819490926
081949092X
Edition
Second edition.
Publication
Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) : SPIE Press, [2012]
Copyright Notice Date
©2012
Physical Description
1 online resource (xix, 656 pages) : illustrations
Local Notes
Access is available to the Yale community.
Notes
"SPIE Digital Library."--Website
English.
Access and use
Access restricted by licensing agreement.
Summary
Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technologies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations.
Variant and related titles
Knovel. OCLC KB.
Other formats
Print version:
Format
Books / Online
Language
English
Added to Catalog
October 02, 2023
Series
SPIE Press monograph ; PM220
Bibliography
Includes bibliographical references.
Contents
Preface to the first edition
Preface to the second edition
Chapter 1. Introduction
Chapter 2. Introduction to integrated circuit fabrication
Chapter 3. Semiconductor basics
Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering
Chapter 5. Thermal processes
Chapter 6. Photolithography
Chapter 7. Plasma basics
Chapter 8. Ion implantation
Chapter 9. Etch
Chapter 10. Chemical vapor deposition and dielectric thin films
Chapter 11. Metallization
Chapter 12. Chemical mechanical polishing
Chapter 13. Process integration
Chapter 14. Integrated circuit processing technologies
Chapter 15. Future trends and summary.
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