Title
Fracture mechanics and technology : proceedings of an International Conference on Fracture Mechanics and Technology, held at the Convention Centre, Hong Kong, March 21-25, 1977 / editors, G. C. Sih, C. L. Chow.
Physical Description
2 v. (xxx, 1615 p.) : ill., diagrs., graphs ; 25 cm.
Notes
Sponsored by Lehigh University, Bethlehem, Pa. and the University of Hong Kong, Hongkong.