Clear Search

Books+ Search Results

Recently Added: Is
Is Is Not
within 6 Months
Format: Is
Is Is Not
Online
Subject with Hierarchy: Is
Is Is Not
Microelectronic packaging

Advanced Search

Basic Search
Help
Add a row
Reset

Limit results by

Remove Online Limit
Viewing Online Items
1.
Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration
Author
International Symposium on High Density Packaging and Microsystem Integration
Published
Piscataway, NJ : Institute of Electrical and Electronic Engineers
Online
Full text
Location
Yale Internet Resource >> None
Format
Journals & Newspapers / Online
2.
MEMS design, fabrication, characterization, and packaging 30 May-1 June 2001, Edinburgh, UK
Published
Bellingham, Wash., USA : SPIE, ©2001.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
3.
Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore
Published
Bellingham, Wash., USA : SPIE, ©2000.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
4.
Design, test, integration and packaging of MEMS/MOEMS
Author
Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, issuing body
Published
[Bellingham, Wash.] : [SPIE--the International Society for Optical Engineering]
Piscataway, NJ : Institute of Electrical and Electronics Engineers
Online
Full text
Location
Yale Internet Resource >> None
Format
Journals & Newspapers / Online
5.
Microelectronics technology : polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995
Published
Washington, DC : American Chemical Society, 1995.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
6.
Optoelectronic interconnects II 26-27 January 1994, Los Angeles, California
Published
Bellingham, Wash., USA : SPIE, ©1994.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
7.
IEEE Multi-Chip Module Conference (MCMC) : [proceedings]
Author
IEEE Multi-Chip Module Conference
Published
[Los Alamitos, Calif.] : [IEEE Computer Society Press]
Online
Full text
Location
Yale Internet Resource >> None
Format
Journals & Newspapers / Online