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Microelectronic packaging

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1.
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Author
Tummala, Rao
Published
New York, N.Y. : McGraw-Hill Education, [2019]
?2019
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
2.
IMAPS (2016)
Published
[Bradford, England] : Emerald Publishing Limited, 2017.
©2017
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
3.
IMAPS Poland 2016
Published
[Bradford, England] : Emerald Publishing Limited, 2017.
©2017
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
4.
Adhesion in microelectronics
Published
Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014.
©2014
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
5.
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia
Published
Zurich, Switzerland : TTP, 2014.
©2014
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
6.
Microwave and millimeter-wave electronic packaging
Author
Sturdivant, Rick
Published
Boston, [Massachusetts] ; London, [England] : Artech House, 2014.
©2014
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
7.
Microwave and millimeter-wave electronic packaging
Author
Sturdivant, Rick
Published
Boston [Massachusetts] ; London [England] : Artech House, 2014.
©2014
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
8.
Reliability, packaging, testing, and characterization of MOEMS/MEMS, nanodevices, and nanomaterials XIII : 3-4 February 2014, San Francisco, California, United States
Published
Bellingham, Washington : SPIE, [2014].
©2014
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
9.
Hermeticity testing of MEMS and microelectronic packages
Author
Costello, Suzanne
Published
Boston : Artech House, [2013]
©2013
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
10.
Reliability, packaging, testing, and characterization of MOEMS/MEMS and nanodevices XII : 4-5 February 2013, San Francisco, California, United States
Published
Bellingham, Washington : SPIE, [2013]
©2013
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
11.
LCP for microwave packages and modules
Published
Cambridge ; New York : Cambridge University Press, 2012.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
12.
Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices XI : 23-24 January 2012, San Francisco, California, United States
Published
Bellingham, Wash. : SPIE, ©2012.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
13.
Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010
Author
International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Published
Switzerland : Trans Tech Publications, 2011.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
14.
Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
Author
Liu, S. (Sheng), 1963-
Published
Hoboken, N.J. : Wiley, 2011.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
15.
Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing
Author
Liu, S. (Sheng), 1963-
Published
Hoboken, N.J. : Wiley, 2011.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
16.
Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X : 24-25 January 2011, San Francisco, California, United States
Published
Bellingham, Wash. : SPIE, ©2011.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
17.
Semiconductor Packaging : Materials Interaction and Reliability
Author
Chen, Andrea
Published
Hoboken : CRC Press, 2011.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
18.
Advanced MEMS packaging
Published
New York : McGraw-Hill, [2010]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
19.
Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX : 25-26 January 2010, San Francisco, California, United States
Published
Bellingham, Wash. : SPIE, ©2010.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
20.
Photonics packaging, integration, and interconnects IX : 26-28 January 2009, San Jose, California, United States
Published
Bellingham, Wash. : SPIE, 2009.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
21.
Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices VIII : 28-29 January 2009, San Jose, California, United States
Published
Bellingham, Wash. : SPIE, 2009.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
22.
Introduction to system-on-package (SOP) miniaturization of the entire system
Author
Tummala, Rao R., 1942-
Published
New York : McGraw-Hill, [2008]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
23.
Photonics packaging, integration, and interconnects VIII : 22-24 January 2008, San Jose, California, USA
Published
Bellingham, Wash. : SPIE, ©2008.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
24.
Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA
Published
Bellingham, Wash. : SPIE, 2008.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
25.
Photonics packaging, integration, and interconnects VII : 23-25 January, 2007, San Jose, California, USA
Published
Bellingham, Wash. : SPIE, ©2007.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online