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Microelectronic packaging
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Viewing Online Items
1.
Adhesion in microelectronics
Published
Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014.
©2014
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
2.
LCP for microwave packages and modules
Published
Cambridge ; New York : Cambridge University Press, 2012.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
3.
... IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics and ... IEEE Interdisciplinary Conference on Portable Information Devices
Author
IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics
Published
Piscataway, NJ : IEEE
Online
Full text
Location
Yale Internet Resource >> None
Format
Journals & Newspapers / Online
4.
Semiconductor manufacturing handbook
Published
New York : McGraw-Hill, [2005]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
5.
Electronic materials and processes handbook
Published
New York : McGraw-Hill, [2003]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
6.
Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials
Published
New York : McGraw-Hill, [2003]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
7.
Area array packaging handbook
Author
Gilleo, Ken
Published
New York : McGraw-Hill, [2002]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
8.
Fundamentals of microsystems packaging
Published
New York : McGraw-Hill, [2001]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
9.
Microvias : for low-cost, high-density interconnects
Author
Lau, John H.
Published
New York : McGraw-Hill, [2001]
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online
10.
Microelectronics technology : polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995
Published
Washington, DC : American Chemical Society, 1995.
Online
Online book
Location
Yale Internet Resource >> None
Format
Books / Online